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主頁 > 探索工程 > 活動回顧 > Memorandum of Understanding (MoU) Signing with CLP, HKT, Siemens on Nurturing IoT Talents
Memorandum of Understanding (MoU) Signing with CLP, HKT, Siemens on Nurturing IoT Talents
2020 年 10 月
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